到岗时间:不限
年龄要求:不限
性别要求:不限
婚况要求:不限
JobResponsibilities:
1.ProcessOptimization/RecipeGenerationforDPprocess(BackGrinding/WaferMount/DieSawing)2.Troubleshootandresolveproductivity/yieldissuesforHVMdevice.3.PerformprocessDOEtooptimizeprocessparameter4.PerformNewDPMaterialQualification&Processdevelopmenttomeetnewtechnologyroadmap.5.DevelopBestKnownMethodology(BKM)&identifyopportunityforquality&costimprovement.6.Performbuy-offandqualificationofDPequipments
JobRequirements:
1.BG/DSRecipeGeneration/ParameterSetting2.DPMachineOperation&ProcessTroubleshooting3.Knowledgeablefordifferentwafer&diedefectpattern4.Knowledgeableinuseofstatisticaltoolssuchas,DOE,paretocharts,commonalityanalysis,SPCetc5.Shouldpossesssufficientunderstandingaboutwheel&bladepropertiesandrelatedDPmaterials(tape,diamaflow)6.KnowledgeableonDPmachinepropertiesandmachinecapability.7.KnowledgeableonadvancedDPtechnologiessuchasLowK,thinwafer,DAFdevelop.8.BG/DSRecipeGeneration/ParameterSetting
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